| 摘要 |
PROBLEM TO BE SOLVED: To make waterproof a substrate and an electronic component mounted on the substrate by preventing a resin from being peeled off even when the adhesiveness of the resin to the substrate and a case is deteriorated. SOLUTION: A substrate 21 on which an electronic component 8 is mounted to an upper side from the bottom plate 3a of a case 3 opening upward is anchored with screws at plural positions, and then a resin 25 is filled from the mounting surface side of the substrate 21 to apply waterproofing to the substrate 21. The waterproof structure of the substrate 21 is formed by providing, around a screw anchoring part D of the substrate 21, a plurality of through holes 26 in which the resin 25 can be filled. COPYRIGHT: (C)2005,JPO&NCIPI
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