发明名称 |
PLATE-SHAPED SUBSTRATE FOR FORMING SEMICONDUCTOR ELEMENT, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR ELEMENT USING IT |
摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the leakage current of a nitride-based compound semiconductor element having a multilayered buffer region becomes larger. SOLUTION: The buffer region 3 constituted by repeatedly arranging first AlN layers L1, second GaN layers L2, and third AlGaN layers L3 is formed on a silicon substrate 2. The rate of Al in the third AlGaN layers L3 is adjusted to zero or to a value between the rates of Al in the second and first layers L2 and L1. When the rate of Al in the third layers L3 is low, the occurrence of a two-dimensional electronic gas is suppressed. Then a nitride-based compound semiconductor region 4 for HEMT element is formed on the buffer region 3. Since the occurrence of the two-dimensional electronic gas in the buffer region 3 is suppressed, the buffer region 3 becomes higher in resistance and the leakage current of a HEMT element is suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005158889(A) |
申请公布日期 |
2005.06.16 |
申请号 |
JP20030392945 |
申请日期 |
2003.11.21 |
申请人 |
SANKEN ELECTRIC CO LTD |
发明人 |
OTSUKA KOJI;YANAGIHARA MASAKI;KANEKO NOBUO |
分类号 |
H01L29/26;H01L21/205;H01L21/335;H01L21/338;H01L29/20;H01L29/778;H01L29/812;(IPC1-7):H01L21/338 |
主分类号 |
H01L29/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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