| 摘要 |
PROBLEM TO BE SOLVED: To make a lower wiring layer and an upper wiring layer stably connectable to each other through an isolated pattern in a semiconductor device. SOLUTION: In the semiconductor device, dummy wiring layers 2a and 2c are disposed on both sides of the lower wiring layer 2b, and the isolated pattern 6 is disposed on an intermediate layer formed between the lower and the upper wiring layers 2b and 10. Then a plurality of dummy contacts C1 are connected to the dummy wiring layer 2a, and a plurality of other dummy contacts C3 are connected to the dummy wiring layer 2c. In addition, the lower wiring layer 2b and the isolated pattern 6 are connected to each other through a plurality of contacts C2 and the pattern 6 and the upper wiring layer 10 are connected to each other through a plurality of other contacts C4. COPYRIGHT: (C)2005,JPO&NCIPI
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