发明名称 DEVICE AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating device that can appropriately perform a half-exposing process and a chemical dissolving and reflowing process. SOLUTION: The substrate treating device is integrally provided with a substrate transporting mechanism 12 which transports a substrate, a chemical treatment unit 21 which performs chemical treatment on the substrate, and a gas atmosphere treatment unit 22 which performs gas atmosphere treatment on the substrate. Alternatively, the device is integrally provided with the substrate transporting mechanism 12 which transports the substrate, a temperature adjusting unit 19 which adjusts the temperature of the substrate, and the gas atmosphere treatment unit 22 which performs the gas atmosphere treatment on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159293(A) 申请公布日期 2005.06.16
申请号 JP20040230665 申请日期 2004.08.06
申请人 NEC KAGOSHIMA LTD 发明人 KIDO SHUSAKU
分类号 H01L21/3065;C23F1/00;H01L21/02;H01L21/027;H01L21/304;H01L21/306;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/3065
代理机构 代理人
主权项
地址