| 摘要 |
Address electrode patterns are formed on a rear surface glass substrate using a silver paste for forming address electrodes, and these patterns are dried. The average particle size of the silver powder in the silver paste is approximately 10 nm, and the softening point of the glass frit is approximately 420° C. The content ratio of the glass frit in the silver paste is set to 5 wt %. Then, a dielectric layer pattern is formed by using glass paste for forming a white dielectric layer so as to cover the address electrode patterns, and this dielectric layer pattern is dried. The glass frit in the glass paste has a softening point of approximately 540° C. Then, the address electrode patterns and the dielectric layer patterns are baked at a temperature of 540° C. Thus, the resin components in the address electrode patterns and the dielectric layer pattern are burnt away, and the glass frit components are softened so as to be fixed onto the rear surface glass substrate.
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