MULTILAYER PRINTED WIRING BOARD

摘要

A multilayer printed wiring board (10) comprising a mounting unit (60) mounting on the surface thereof a semiconductor element electrically connected with a wiring pattern (32) or the like, and a laminar capacitor unit (40) having a ceramic high-dielectric layer (43) and first and second laminar electrodes (41), (42) sandwiching the high-dielectric layer (43), with one of the first and second laminar electrodes (41), (42) connected with the power supply line of the semiconductor element and the other with a ground line. Since the high-dielectric layer (43) of the laminar capacitor unit (40) connected between the power supply line and the ground line in this multilayer printed wiring board (10) is made of ceramics, the electrostatic capacity of the laminar capacitor unit (40) can be increased. Accordingly, a sufficient decoupling effect is exhibited even under a state where instantaneous lowering of potential is likely to occur.