发明名称 PACKAGE FOR LIGHT EMITTING ELEMENT HOUSING, METHOD FOR MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a small-sized package for light emitting element housing which reflects efficiently light emitted from a light emitting element and can emit the light to exterior of an extensive region uniformly and efficiently, and to provide a light emitting device. <P>SOLUTION: In the package for light emitting element housing, a recess 4 for accommodating the light emitting element 3 is formed on an upper surface, and an insulating substrate 1 wherein the loading portion 2 of the light emitting element 3 is formed on the bottom surface of the recess 4, and wiring conductors 5a, 5b are installed with which electrodes of the light emitting element 3 are electrically connected to the bottom surface of the recess 4. In the recess 4, a metallized layer 7 is formed on an interior side wherein a central part is thicker than an upper side and the surface is made a curved surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159082(A) 申请公布日期 2005.06.16
申请号 JP20030396920 申请日期 2003.11.27
申请人 KYOCERA CORP 发明人 OKAMURA TAKUJI
分类号 H01L33/60 主分类号 H01L33/60
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