SEMICONDUCTOR WAFER, DOUBLE-SIDED POLISHING METHOD THEREFOR SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER AND CARRIER PLATE

摘要

PROBLEM TO BE SOLVED: To provide a double-sided polishing method for a semiconductor wafer capable of easily reducing the outer peripheral sag of the semiconductor wafer, the semiconductor wafer which is polished by the double-sided polishing method for the semiconductor wafer and in which the outer peripheral sag is reduced, and a carrier plate for a double-sided polishing device properly used for the double-sided polishing method for the semiconductor wafer.

SOLUTION: The double-sided polishing method for the semiconductor wafer is composed of a primary double-sided polishing process polishing both surfaces of the wafer, and a secondary double-sided polishing process correcting the outer peripheral sag of the wafer generated in the primary double-sided polishing process.

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