| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of treating substrate by which a process of working an organic film pattern into a new pattern form can be performed smoothly by performing second developing treatment. SOLUTION: In the method of treating substrate, pretreatment performed for removing a damaged layer formed on the surface of the organic film pattern and the second developing treatment performed for contracting at least part of the organic film pattern or removing part of the pattern are performed in this order. Since the developing treatment is performed after the damaged layer is removed by the pretreatment, the second developing treatment can be performed smoothly and highly uniformly. Therefore, the working of a base film into a pattern performed after the developing treatment can be performed highly uniformly. COPYRIGHT: (C)2005,JPO&NCIPI |
