| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of treating substrate by which the damage given to an organic film pattern or substrate can be suppressed. SOLUTION: The method of manufacturing the substrate includes an organic film pattern working step of working the organic film pattern formed on the substrate. In the organic film pattern working step, a removing step of removing a decomposed layer or deposited layer formed on the surface of the organic film pattern, and a melting and deforming step (step S3) of melting and deforming the organic film pattern are performed in this order. At least part of the removing step is performed by performing chemical treatment (step S1) on the organic film pattern. COPYRIGHT: (C)2005,JPO&NCIPI |
