BUMP FORMING DEVICE FOR CHARGE GENERATING SEMICONDUCTOR SUBSTRATE AND METHOD FOR REMOVING CHARGE OF CHARGE GENERATING SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a bump forming device in which the removal of charge of a charge generating semiconductor substrate is carried out, and a method for removing the charge of the charge generating semiconductor substrate which is carried out for the bump forming device. SOLUTION: A control device 180 executes temperature lowering control when a wafer is cooled down, at least after bump bonding is applied to a wafer 202, thereby removing the charge stored on the rear surface 202b of the wafer. Accordingly, the quantity of charge on the rear surface can be more reduced in comparison with a conventional method. Damage to the circuits formed on the wafer caused by the charging or damages such as cracks of the wafer itself can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI