RESIN COMPOSITION FOR SEMICONDUCTOR DAM

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for dams which has a rapid curing time and gives a dam having good external appearances. SOLUTION: The resin composition for semiconductor dams comprises a liquid epoxy resin and a cationic polymerization initiator as a curing agent, and is designed to have the ratio of thickening of at most 20%/week at 120°C and the gel time of at least 2 sec and at most 12 sec at 150°C and at least 30 sec and at most 45 sec at 120°C. COPYRIGHT: (C)2005,JPO&NCIPI