| 摘要 |
The invention relates to a device which is used to turn over electronic components (91, 92, 93) and to the related method. According to the invention, the location (a) of the electronic components (91, 92, 93) on the device prior to their being turned over is identical to the location (a) from where the electronic components (91, 92, 93) are removed from the device thereafter. In this way, the device can be integrated into an electronic component processing line (8) irrespective of the configuration of the previous and next processing stations.
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