| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein no cracking is generated in an insulating board even if a heat due to operation of a semiconductor device and a change in operating environment temperature is repeatedly applied, and connection reliability is superior between the semiconductor device and a wiring board. <P>SOLUTION: An extending part 11 extending toward the outside of a mounting part is formed on a connection pad 2a arranged around the outermost circumference. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
