LAMINATED SUBSTRATE AND MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD AND APPARATUS OF MODULE USING THE LAMINATED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To solve a problem that some trouble occurs in connection reliability when the mounting density of electronic components rises in the laminated substrate in which electronic components are embedded.

SOLUTION: A substrate 1001 on which lands provided on the upper surface and an integrated circuit 1005 or the like are connected and fixed with solder 1007 and a sheet 1011 which is laminated on the upper surface of this substrate 1001 and includes a resin flow embedding portion formed with a gap 1008 at the external circumference of an integrated circuit 1005 or the like are provided. This sheet 1011 is formed with heated pressurization after impregnating the resin 1016 having thermo-fluidity to an woven or unwoven cloth, while maintaining such a woven or nonwoven fabric to which a hole 1012 is provided for embedding the integrated circuit 1005 or the like.

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