发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a process can be carried out in accordance with set conditions. SOLUTION: A reaction chamber and a vacuum pump are connected with a flexible tube composed of a tube body which has convex parts and concave parts and is formed of a hard material, and composed of a cover which is arranged on the outer surface of the tube body and is formed of an elastic material. After a semiconductor substrate is positioned in the reaction chamber, a reaction gas is fed into the reaction chamber which is made in a reduced pressure state by operating the vacuum pump. By reacting this reacting gas, the reactant is deposited on the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159375(A) 申请公布日期 2005.06.16
申请号 JP20050028402 申请日期 2005.02.04
申请人 OKI ELECTRIC IND CO LTD 发明人 TAKAARA EIJI
分类号 C23C14/24;C23C14/34;C23C14/48;C23C16/44;H01L21/02;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C14/24
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