| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized wiring board of high density wiring for which many external lead terminals are attached to a small-sized insulating substrate. SOLUTION: The wiring board 9 is provided with the insulating substrate 1 for which an electronic component loading part 1a is formed at the center of an upper surface and a plurality of wiring conductors 2 are formed from the periphery of the loading part 1a to an outer peripheral part on the upper surface, connection pads 3 respectively formed at the end parts on the outer peripheral side of the plurality of wiring conductors 2, and the plurality of external lead terminals 4 attached to the connection pads 3 at one end and installed in parallel to each other. The plurality of connection pads 3 are arrayed in a plurality of columns along the edge of the insulating substrate 1 and formed such that the connection pad 3 in the column on the inner peripheral side adjacent to the column on the outer peripheral side is positioned at a center position between the adjacent connection pads 3 in the column on the outer peripheral side. For the plurality of external lead terminals 4, the ones attached to the connection pads 3 in the column on the inner peripheral side are provided with bend parts so as to straddle a part between the attaching parts of the ones attached to the connection pads 3 in the column on the outer peripheral side. COPYRIGHT: (C)2005,JPO&NCIPI
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