发明名称 MULTIPIECE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multipiece wiring board in which wiring boards formed as a plurality of vertical and horizontal arrays and having high reliability of electrical connection can be produced on a ceramic mother board having extremely thin thickness, and a wide area and wiring boards having no notch, crack or the like can be surely formed. SOLUTION: The multipiece wiring board is provided with a ceramic mother board 2 on which a plurality of vertical and horizontal arrays of wiring board areas 1 are formed, a plurality of wiring conductors 3 formed through the wiring board areas 1 and electrodes 4 formed on a pair of end faces of the ceramic mother board 2 and electrically connected to the wiring conductors 3. Each electrode 4 consists of a metalized layer 6 coated on the whole inner surface of a notch part 5 formed on each of a pair of end faces of the ceramic mother board 2 and the notch part 5 consists of a 1st notch 5-1 and a 2nd notch 5-2 formed by further notching the center part of the 1st notch 5-1. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159083(A) 申请公布日期 2005.06.16
申请号 JP20030396921 申请日期 2003.11.27
申请人 KYOCERA CORP 发明人 ONIZUKA YOSHITOMO
分类号 H05K1/02;H01L23/13;(IPC1-7):H05K1/02 主分类号 H05K1/02
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