| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging resin case for a semiconductor device for suppressing the occurrence of cracks. SOLUTION: The terminal block 2 of the packaging resin case for a semiconductor device comprises a nut insertion 20 and a nut supporter 30. In the nut insertion 20, a nut insertion hole 21 for loosely fitting a nut 40 is provided. Projections 22a, 22b are provided on an inner surface 121 of the nut insertion hole 21. Then, the nut 40 presses the projection 22a by rotational force operating on the nut 40, when a screw or the like is screwed to the nut 40 by a prescribed clamping torque. Additionally, when removing a screw, or the like screwed to the nut 40 from the nut 40 by a prescribed clamping torque, the nut 40 presses the projection 22b by rotational force operating on the nut 40. COPYRIGHT: (C)2005,JPO&NCIPI
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