| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of connecting the electrode of an electronic component normally with a connection pad through solder by recognizing a mark for positioning the electronic component accurately through an image recognition system. SOLUTION: After first solder paste 21 is printed on a mark 3 for positioning an electronic component formed of a conductor layer on the surface of an insulating substrate 1, solder 6 in the first solder paste 21 is thermally fused and welded to the mark 3. Subsequently, second solder paste 23 having viscosity higher than that of the first solder paste 21 is printed on a connection pad 2a formed of the same conductor layer as that of the mark 3 on the surface of the insulating substrate 1 and then solder 4 in the second solder paste 23 is thermally fused and welded to the connection pad 2a. COPYRIGHT: (C)2005,JPO&NCIPI
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