| 摘要 |
PROBLEM TO BE SOLVED: To improve quality determination accuracy of a wiring pattern, when inspecting the wiring pattern by irradiating the wiring pattern formed on the surface of a test substrate with laser light. SOLUTION: This substrate inspection device is equipped with a laser device 3 for irradiating a conductor part 202 with the laser light, multistylus contactors 61-64 in contact with pads 206-209 simultaneously respectively, a transparent electrode plate 51 for capturing electrons emitted from the conductor part 202 by the laser light, a direct-current power source 75 for generating a potential difference between the contactors 61-64 and the transparent electrode plate 51, switches 71-74 for switching on/off connection between the contactors 61-64 and the power source ground, and an ammeter 53 for measuring a current caused by electrons captured by the transparent electrode plate 51. The device is constituted so that, when the switches 71-74 are switched on and the conductor part 202 is irradiated with the laser light, the quality of the wiring pattern 216 having the conductor part 202 on a part is determined based on a current value measured by the ammeter 53. COPYRIGHT: (C)2005,JPO&NCIPI
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