发明名称 SHEET MOLDING COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide a rapidly curable sheet molding compound which has a proper gel time and can reduce the molding cycle time by shortening the time from the gel time to the completion of curing. SOLUTION: The sheet molding compound comprises a fiber substrate impregnated with an unsaturated polyester resin composition comprising an unsaturated polyester resin, polymerizable monomers, a curing agent, a shrinkage-reducing agent, a polymerization inhibitor, a filler and a thickening agent, where the curing agent comprises t-amyl peroxybenzoate and t-amyl peroxyisononanoate. Preferably, the mixing ratio by weight of t-amyl peroxybenzoate to t-amyl peroxyisononanoate is 95/5 to 20/80. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005154458(A) 申请公布日期 2005.06.16
申请号 JP20030390598 申请日期 2003.11.20
申请人 HITACHI HOUSETEC CO LTD 发明人 KIMURA MAMORU;HAMANO TAKAKO
分类号 C08J5/24;C08F283/01;C08K3/00;C08K5/14;C08L67/06;C08L101/00;(IPC1-7):C08J5/24 主分类号 C08J5/24
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