首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JP2005517536(A)
申请公布日期
2005.06.16
申请号
JP20030541728
申请日期
2002.11.06
申请人
发明人
分类号
B32B7/02;B81B3/00;(IPC1-7):B81B3/00
主分类号
B32B7/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Methods of manufacturing semiconductor devices including a cross point cell array
Solid-state imaging device and imaging system
Semiconductor apparatus
Circuit module having a substrate, semiconductor chip, and molding material formed by dicing
Semiconductor package having a metal paint layer
Semiconductor device and method of forming through mold hole with alignment and dimension control
Package for an integrated circuit
Semiconductor device
Mechanisms for forming package structure
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
Method for forming interconnect structure that avoids via recess
Substrate processing system and substrate transferring method
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
Composite material, method of producing the same, and apparatus for producing the same
Trench sidewall protection for selective epitaxial semiconductor material formation
Plasma processing apparatus, plasma processing method and storage medium
Microwave waveguide apparatus, plasma processing apparatus and plasma processing method
Techniques for fabricating Janus sensors
Process for the manufacture of carbon sheet for an electrode
Multilayer ceramic condenser and method of manufacturing the same