| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for machining a wafer which grinds the wafer by a grinding means and is provided with a polishing means for applying proper polishing to a working face of the ground wafer. <P>SOLUTION: The device for machining a wafer is provided with a rotatably arranged turntable 3, a chuck table 4 for holding the wafer, which is arranged to the turntable, the grinding means 8, 80 for grinding the wafer, and a multi-purpose polishing means 10 for polishing a grinding face of the wafer. The multi-purpose polishing means is provided with a mounter capable of attachably/detachably mounting a polishing tool, a spindle unit for rotating the mounter, a spindle unit support means, which supports the spindle unit movably in the direction vertical to a holding face of the chuck table and in the direction parallel to the holding face, and a polishing feed means for moving the spindle unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
