| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for solder inspection, capable of effectively utilizing inspection result information determined in solder inspections and improving the usefulness of print inspections. <P>SOLUTION: In solder inspections for inspecting the printed state of solder printed on substrates, determined results acquired by inspections are cumulatively stored for every electrode of the substrates for each substrate. When a reference is made to the inspection result information, accumulated determined results are displayed on a solder print location map of a screen 34, to indicate the locations of the occurrences of failure and the frequency, by means of the locations and sizes of balloon marks 36, and detailed information such as relation with printing directions and the types of failures are further displayed as necessary. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
