| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems of a polishing tool, including increased machining resistance, abrasive slipout, and clogging with chips, occurring in polishing a component part such as a silicon wafer. SOLUTION: The polishing tool has a base material, and a polishing layer fixed to the base material by means of a binder and having abrasive grains and magnetic grains, or abrasive grains formed of a magnetic material. Then a magnetic field is applied to the polishing tool from outside to oscillate the polishing layer in a direction perpendicular to a surface to be machined. Thus a time period for which the abrasive grains make contact with the surface to be machined is shortened, and therefore incision in the surface to be machined by the abrasive grains can be made fine, leading to reduction in damage on the surface to be machined. COPYRIGHT: (C)2005,JPO&NCIPI
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