发明名称 Bonding apparatus and bonding external appearance inspection apparatus
摘要 A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68 . The light path 80 that passes through a parallel flat plate includes a half-mirror 82 disposed in the light path, a parallel flat plate 86 , and a reflective mirror 88 which is disposed perpendicular to the optical axis of the light rays 96 that have passed through the parallel flat plate 86 and which performs a mirror reflection operation, in a plane perpendicular to the optical axis, on the light rays 96 , so that the light rays again return to the parallel flat plate 86 as reflected light 98.
申请公布号 US2005127136(A1) 申请公布日期 2005.06.16
申请号 US20040781375 申请日期 2004.02.18
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 HARAGUCHI MANABU
分类号 H01L21/66;B23K20/00;B23K31/12;H01L21/00;H01L21/60;(IPC1-7):B23K31/12 主分类号 H01L21/66
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