Method of soldering components onto a printed circuit board involves applying fluid solder by machine to a locally defined area of the circuit board

摘要

The method of mounting components onto a circuit board (1) on which at least solder deposit (2) is already provided involves applying a fluid (3) by machine to a locally defined area of the solder deposit. The component is then placed on the circuit board and is connected by a solder process. The fluid can be applied by an ink jet printer head (10). If several solder deposits are provided, the fluid can be applied using a mask printing process.