| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a very thin semiconductor device suitable for a fine flip bonding system and also for dealing with heat dissipation, and further to provide its manufacturing method and a semiconductor device. SOLUTION: In the substrate 100 for mounting a semiconductor chip, wiring layers 41, 42, 43 are formed on a heat slag 11 composed of a metal substrate or the like via insulating layers 21, 23, 25, and 27; and thermal vias 51, 53, 55, 57 and vias 54, 56, 58 are formed on the same. Further, a semiconductor mounting pad 44 and a solder ball pad 45 are formed on an uppermost layer. The heat slag 11 is connected with the uppermost layer semiconductor mounting pad 44 through the thermal vias 51, 53, 55, 57 to lead heat of a semiconductor chip to the heat slag 11 for heat dissipation from the heat slag 11. COPYRIGHT: (C)2005,JPO&NCIPI |
