| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable printed wiring board without deteriorating the printed wiring board owing to a temperature load and a thermal shock load or the like. SOLUTION: The hole filling device comprises conveyance mean 8 for conveying a substrate 1 in a predetermined direction D, on the substrate a roller 5 for applying a filling material 3 from the side of a first surface 1b, a first squeegee 7B in slidable contact with the first surface for scraping the filling material 3b, and a second squeegee 7A in slidable contact with the second surface 1a for scraping the filling material 3a. The first and second squeegees have their positions where they make slidable contact with the first and second surfaces, which are separated by a distance ST. The distance ST satisfies -3.0mm≤ST≤-0.5mm or 0.5mm≤ST≤3.0mm when it takes a positive number provided that the first squeegee more approaches the roller than the second squeegee. COPYRIGHT: (C)2005,JPO&NCIPI
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