发明名称 |
Integrated heat dissipating enclosure for electronic product |
摘要 |
An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
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申请公布号 |
US2005126806(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20030437008 |
申请日期 |
2003.05.14 |
申请人 |
MENG-CHENG HUANG;MING-YANG LIN |
发明人 |
MENG-CHENG HUANG;MING-YANG LIN |
分类号 |
G06F1/18;G06F1/20;H05K5/00;H05K7/20;(IPC1-7):H05K5/00 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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