| 摘要 |
An n-well is formed in a p-type semiconductor substrate. A gate insulative film is formed to the p-type semiconductor substrate and the n-well, and a gate electrode is formed on the gate insulative film. A source layer selectively diffused with n-type impurities at high concentration is formed adjacent to the gate insulative film on the surface of the p-type semiconductor substrate, the n-well and a region extending on both of them. Further, a contact layer selectively diffused with p-type impurities at high concentration is formed being spaced from the source layer. A capacitance characteristic of good linearity over a wide range relative to the inter-terminal voltage VT can be obtained by applying an inter-terminal voltage VT between the source layer and the gate electrode. A MOS type variable capacitance device capable of obtaining a characteristic of good linearity for a wide range relative to the inter-terminal voltage VT and capable of coping with the improvement of the performance of a VCO circuit, etc., as well as simple in the structure, and capable of being manufactured easily with no requirement for addition of masks and steps can be provided.
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