| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad, capable of suppressing occurrence of scratches on the surface of a polished object in a chemical mechanical polishing process and capable of giving the surface of a polished object having superior surface flatness. <P>SOLUTION: The chemical mechanical polishing pad that is to be used for chemical mechanical polishing comprises a surface for polishing the polished object, a non-polishing surface, which is the opposite surface of the polishing surface a surface for connecting both the surfaces, and a recessed pattern on the non-polishing surface which has an opening on the top surface but not on the side surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
