| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board having a high dimensional accuracy and capable of suppressing an occurrence of an interlaminar exfoliation. SOLUTION: The multilayer circuit board 10 is formed by adjacently laminating each other a first plurality of insulating layers 1a to 1d comprising a first inorganic composition of matter, and a second plurality of insulating layers 1e to 1j comprising a second inorganic composition of matter which is thicker than the first insulating layers 1a to 1d and begins to shrink in conjunction with a sintering by high temperatures higher than that of the first inorganic composition of matter. The board 10 comprises a conductive layer 2 comprising a conductive material thinner than the second insulating layers 1e to 1j and beginning to shrink in conjunction with a sintering by high temperatures higher than the shrink-starting temperature of the second insulating layers 1e to 1j interposed between the adjacent second insulating layers. COPYRIGHT: (C)2005,JPO&NCIPI |
