| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with a capacitor element in which a first connection pad and a semiconductor element connected electrically therewith can be connected well through a solder bump. <P>SOLUTION: After first solder paste 21 is printed on first connection pads 2a, 2b and 2c, a solder bump 6 is formed by thermally fusing solder powder in the first solder paste 21. After the upper end of the solder bump 6 is flattened to form an upper end face, the solder bump 6 is covered with a protective layer 31 capable of holding the shape and second solder paste 22 containing solder powder having a melting point higher than that of the solder bump 6 is printed on second connection pads 5a and 5b. Subsequently, a capacitor element 7 is mounted on the second solder paste 22 and connected with the connection pads through solder 8 by thermally fusing solder powder in the second solder paste 22 thus producing a wiring board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
