| 摘要 |
Adhesive films in which an epoxy resin composition comprising the following components (A) to (C): (A) an aromatic epoxy resin having two or more epoxy groups in a molecule; (B) a cyanate compound having two or more cyanato groups in a molecule; and (C) a phenoxy resin having a weight average molecular weight of from 5,000 to 100,000, is laminated on a support film, and a prepreg in which a sheet-like reinforcing base material made of a fiber is impregnated with the epoxy resin composition comprising the components (A) to (C) are excellent for forming insulation layers in multilayer printed circuit boards.
|
