Semiconductor device, method of manufacturing semiconductor device, semiconductor chip, electronic module and electronic equipment

摘要

A semiconductor device is provided. At least two second group electrodes are located in each of a plurality of regions partitioned by a plurality of second lines orthogonalized with a first line. Each of the regions is a region surrounded by a pair of the second lines contacting and sandwiching a pair of first group electrodes adjacent to each other. The thus formed semiconductor chip is mounted on a substrate such that the first group electrodes face leads of the first group and the second group electrodes face the leads of the second group. Each lead of the second group is located so as to go through the leads of the first group.