| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and its manufacturing method by which high reliability and a long service life can be achieved by using an adhesion layer of which the glass transition temperature is higher than a soldering temperature. SOLUTION: A laminated body 4 is formed on a ferrite substrate 7, and a ferrite substrate 6 is crimped to the laminated body with adhesion layers 5-1 and 5-2 between so as to form a chip 2. Then external terminals 3-1 to 3-4 are fitted to the chip 2, resulting in a choke coil 1 as an electronic component. In this case, the material used for the adhesion layers 5-1 and 5-2 uses a material of which the glass transition temperature is higher than a soldering temperature. Such the material preferably has a glass transition temperature of 270°C or higher, a thermal expansion modulus of 71 ppm (at 150-250°C) and an elastic modulus of 2.8 GPa. COPYRIGHT: (C)2005,JPO&NCIPI
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