PRINTED WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, ITS PRODUCTION PROCESS AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board for mounting an electronic component having a wiring pattern formed on one side of an insulating film and capable of mounting a semiconductor chip and a passive component through a filled via even on the side opposite to the side where the wiring pattern is formed in which plating liquid, e.g. tin plating liquid does not intrudes into the gap between the filled via and an insulating film, and to provide its production process and a semiconductor device formed by using the printed wiring board. SOLUTION: One end of a filled via 4 is connected with a wiring pattern and the other end is coated with conductive paste to cover at least the boundary of the filled via 4 and an insulating film 2 to form a coating layer 5. A plating layer 6 clad with a conductive metal, e.g. copper, is formed on the surface of the coating layer thus preventing intrusion of tin plating liquid into the gap between the filled via 4 and the insulating film 2. COPYRIGHT: (C)2005,JPO&NCIPI