| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique to form a low resistance barrier film at a low temperature. SOLUTION: A catalyst material 21 is placed within a vacuum vessel 11, it is then heated, a raw material gas and a reactive gas are alternately introduced into the vacuum vessel 11, the raw material gas adsorbed to the surface of a film forming object 40 and the reactive gas are reacted with a radical which is decomposed to generate with the catalyst material 21. Accordingly, a thin film is laminated. A row resistance barrier film can be obtained at a low temperature. As the reactive gas, H<SB>2</SB>gas, NH<SB>3</SB>gas, and SiH<SB>4</SB>gas or the like can be used. COPYRIGHT: (C)2005,JPO&NCIPI
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