| 摘要 |
PROBLEM TO BE SOLVED: To provide such a method for manufacturing a semiconductor device that is superior in throughput by eliminating down time. SOLUTION: The method for manufacturing a semiconductor device includes a step to place a work on one stage of a plurality of processing stages for dicing of the work into pieces, a step to dice the work placed thereon in the previous step, and a step to clean the work pieces diced in the previous step as well as the other stages wherein no work is placed at the same time. COPYRIGHT: (C)2005,JPO&NCIPI |
