| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition for sealing a semiconductor, which prevents poor soldering resulting from poor wetting of solder and occurrence of poor conduction even without treatment with a flux in advance and provides a cured material having excellent properties. SOLUTION: The resin composition for sealing the semiconductor is a resin composition that is useful in a sealing and packing process of flip chip mounting and contains a compound having one or more latent carboxy groups and one or more latent oxetane groups in one molecule, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
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