| 发明名称 |
Electronic component with flexible contacting pads and method for producing the electronic component |
| 摘要 |
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
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| 申请公布号 |
US2005127527(A1) |
申请公布日期 |
2005.06.16 |
| 申请号 |
US20040963434 |
申请日期 |
2004.10.12 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HAIMERL ALFRED;HEDLER HARRY;POHL JENS |
| 分类号 |
H05K3/32;H01L21/60;H01L23/12;H01L23/485;H05K1/18;(IPC1-7):H01L21/44;H01L23/48 |
主分类号 |
H05K3/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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