发明名称 |
Solder bump structure for flip chip package and method for manufacturing the same |
摘要 |
A solder bump structure may have a metal stud formed on a chip pad of a semiconductor chip. Surfaces of the metal stud may be plated with a solder. The metal stud may be located on a substrate pad of the substrate. The substrate pad may have a pre-solder applied thereto. After a solder reflow, the solder bump may have a concave shape. |
申请公布号 |
US2005127508(A1) |
申请公布日期 |
2005.06.16 |
申请号 |
US20040897124 |
申请日期 |
2004.07.23 |
申请人 |
LEE IN-YOUNG;KIM GU-SUNG;JEONG SE-YOUNG;PARK SUN-YOUNG |
发明人 |
LEE IN-YOUNG;KIM GU-SUNG;JEONG SE-YOUNG;PARK SUN-YOUNG |
分类号 |
H01L23/52;H01L21/60;H01L23/485;H05K3/34;(IPC1-7):H01L21/44;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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