| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device and a method of manufacturing the same capable of reducing stress applied to the semiconductor light emitting device, preventing break in a sealing material, and improving the efficiency in taking light out of the semiconductor light emitting device. <P>SOLUTION: A semiconductor light emitting device comprises a substrate 1 in which a concave portion 2 is provided from its surface and a predetermined electric circuit pattern 8 is formed, a semiconductor light emitting device 9 mounted on the bottom surface of the concave portion 2, and a sealing material with which the concave portion 2 is filled and the semiconductor light emitting device 9 is sealed. The sealing material comprises a first sealing material 5 formed to have the thickness equal to the height of the semiconductor light emitting device 9 mounted on the bottom surface of the concave portion 2 and a second sealing material 6 formed on the top surface side of the semiconductor light emitting device 9 and the first sealing material 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
