发明名称 GLASS CERAMIC WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a highly reliable glass ceramic wiring board by preventing the generation of any crack or peeling due to a difference between a dielectric layer and an insulating substrate configuring a capacitor. <P>SOLUTION: An insulating substrate 2 constituted of glass ceramics is incorporated with a capacitor constituted by arranging a pair of opposite electrodes 3a and 3b constituted of metal conductor layers made of copper or copper as main components with a dielectric layer 4 with barium titanate as main components interposed. In this case, a pair of opposite electrodes 3a and 3b are extended to the side face of the dielectric layer 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005159128(A) 申请公布日期 2005.06.16
申请号 JP20030397235 申请日期 2003.11.27
申请人 KYOCERA CORP 发明人 FURUKUWA TAKESHI
分类号 H05K3/46;H01L23/12;H01L23/13;(IPC1-7):H05K3/46 主分类号 H05K3/46
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