| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately and smoothly implement the inspection process of a semiconductor device. <P>SOLUTION: The manufacturing method of a semiconductor device includes a step of performing a packaging process of forming at least a resin layer, a wiring layer passing above the resin layer; and an external terminal electrically connected to the wiring layer on the resin layer on the first region 40 of a semiconductor substrate 10 having the first region 40 composed of a plurality of semiconductor chip regions 20 on which an integrated circuit including a pad is formed, and having a second region 42 around the first region 40. At least a partial process of the packaging process is implemented for the second region 42. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
