发明名称 DEVICE AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating device that can appropriately perform a half-exposing process. SOLUTION: The substrate treating device is integrally provided with a substrate transporting mechanism 12 which transports a substrate, a chemical treatment unit 21 which performs chemical treatment on the substrate, and a developing treatment unit 20 which performs developing treatment on the substrate. Alternatively, the device is integrally provided with the substrate transporting mechanism 12 which transports the substrate, a first chemical treatment unit 21 which performs chemical treatment on the substrate, and a second chemical treatment unit 21 which performs chemical treatment on the substrate. More alternatively, the device is integrally provided with the substrate transporting mechanism 12 which transports the substrate, a first developing treatment unit 20 which performs developing treatment on the substrate, and a second developing treatment unit 20 which performs developing treatment on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159295(A) 申请公布日期 2005.06.16
申请号 JP20040230757 申请日期 2004.08.06
申请人 NEC KAGOSHIMA LTD 发明人 KIDO SHUSAKU
分类号 H01L21/306;G03B27/10;H01L21/00;H01L21/02;H01L21/027;H01L21/304;(IPC1-7):H01L21/306 主分类号 H01L21/306
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