| 摘要 |
PROBLEM TO BE SOLVED: To avoid any damage such as a fracture of a junction part due to a change of temperature in a flat plane shaped electronic component by subjecting a printed board to thermo compression bonding to a liquid crystal display panel via a plurality of tape carrier packages for bonding thereof. SOLUTION: The deformation of the printed board P2 upon its thermal expansion and contraction is approximated with a circular arc (the amount of the deformation: Z). An arcuate radius passing through the center of the same is assumed R, and an angle of a straight line passing through the center O of the circular arc with respect to the center O (center between junction points) of the tape carrier packages P31 and P32 is assumed 2θ. Herein, the packages are joined to satisfy: z=L×ä(1+α<SB>1</SB>)ΔT/2}×ä(1-cosθ)/θ}. Here, it is assumed thatθ/sinθ=(1+α<SB>1</SB>)/(1+α<SB>2</SB>),α<SB>1</SB>: a coefficient of the thermal expansion of the one glass substrate P1,α<SB>2</SB>: a coefficient of the thermal expansion of the printed board P2,ΔT: temperature difference. COPYRIGHT: (C)2005,JPO&NCIPI
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