发明名称 RESIN COMPOSITION FOR SHEET MOLDING COMPOUND AND BULK MOLDING COMPOUND AND APPLICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for a sheet molding compound and a bulk molding compound, having the function of catching formaldehyde formed when cured by radical polymerization and giving a cured product reduced in formaldehyde emission. SOLUTION: The resin composition comprises a resin (A) having an ethylenic unsaturation in the molecule, a monomer (B) having an ethylenic unsaturation, and at least one compound (C) selected from the group consisting of compounds such as hydrazine and urea;β-diketone compounds or the like; and peroxide compounds. A sheet molding compound, a bulk molding compound, and molding thereof are also provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005154589(A) 申请公布日期 2005.06.16
申请号 JP20030395456 申请日期 2003.11.26
申请人 DAINIPPON INK & CHEM INC 发明人 MATSUTANI HIDEFUMI
分类号 C08J5/04;C08F290/14;C08K5/00;C08L101/00;(IPC1-7):C08F290/14 主分类号 C08J5/04
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